Ultrasonic Cutting Machine for Thermal Pad

Our ultrasonic cutting machine for thermal pad is designed for heat dissipation silica gel slicing in 5G cell phones. It can cut slice from 0.3 millimeter to 1 millimeter thin according to different silica gel material. Its precision is extremely high, in order to meet the heat dissipation demand very well.

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cutting thermal conductive silicone pad ultrasonic cutter cutting equipment manufacturer

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